Multilayer printed wiring board

Details Multilayer printed wiring board Multilayer printed wiring board

1988-12-29

1991-11-12

Picard, Leo P.

Electricity: electrical systems and devices

Miscellaneous

174261, H05K 111

Patent

active

050652842

ABSTRACT:
A multilayer printed wiring board is presented for surface mounting or through hole technology, which includes one or more layers of a high capacitance flexible dielectric sheet material. The dielectric sheet is comprised of a monolayer of multilayer or single layer high dielectric constant (e.g. ceramic) chips or pellets of relatively small area and thickness which are arranged in a planar array. These high dielectric constant chips are spaced apart by a small distance. The spaces between the chips are then filled with a flexible polymer/adhesive to define a cohesive sheet with the polymer binding the array of high dielectric (e.g. ceramic) chips together. Next, the opposite planar surfaces of the array (including the polymer) are electroless plated or electroded by vacuum metal deposition, or sputtering, to define opposed metallized surfaces. The board of the present invention alleviates the need for decoupling capacitors, thus resulting in significant, space savings on the board surface.

REFERENCES:
patent: 3932932 (1976-01-01), Goodman
patent: 4388136 (1983-06-01), Huie et al.
patent: 4908258 (1990-03-01), Hernandez

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