Multilayer printed wiring board

Details Multilayer printed wiring board Multilayer printed wiring board

2008-04-09

2011-10-04

Norris, Jeremy (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S792000

Reexamination Certificate

active

08030579

ABSTRACT:
An object of the present invention is to provide a multilayered printed circuit board having a short wiring distance of the conductor circuits, wide option of the design of the conductor circuits and additionally excellent in reliability since cracking scarcely takes place in the interlaminar resin insulating layers in the vicinity of via-holes. The present invention is a multilayered printed circuit board comprising: a conductor circuit and an interlaminar resin insulating layer serially formed on a substrate in alternate fashion and in repetition, wherein a connection of the conductor circuits through the interlaminar resin insulating layers is performed by a via-hole, wherein via-holes in different level layers among the via-holes are formed so as to form a stack-via structure, and wherein at least one of the land diameters of the above-mentioned via-holes in different level layers having the stack via structure is different from the land diameters of other via-holes.

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