Multilayer printed wiring board

Details Multilayer printed wiring board Multilayer printed wiring board

2006-07-06

2010-11-16

Pert, Evan (Department: 2826)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C257SE23062, C257S774000

Reexamination Certificate

active

07834273

ABSTRACT:
A multilayer printed wiring board comprises a plurality of insulating layers which is about 100 μm or less in thickness and a plurality of conductor circuits formed on the insulating layers. Each of a plurality of viaholes electrically connecting conductor circuits on the insulating layers to each other is formed tapered inwardly from the surface of the insulating layer and the viaholes are disposed opposite to each other to form a multistage stacked vias.

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