Multilayer printed wiring board

Details Multilayer printed wiring board Multilayer printed wiring board

2007-07-17

2009-02-10

Dinh, Tuan T (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S794000, C361S803000, C174S260000, C174S267000, C174S268000

Reexamination Certificate

active

07489521

ABSTRACT:
A multilayer printed wiring board (10) includes: a build-up layer (30) that is formed on a core substrate (20) and has a conductor pattern (32) disposed on an upper surface; a low elastic modulus layer (40) that is formed on the build-up layer (30); lands (52) that are disposed on an upper surface of the low elastic modulus layer (40) and connected via solder bumps (66) to a IC chip (70); and conductor posts (50) that pass through the low elastic modulus layer (40) and electrically connect lands (52) with conductor patterns (32). The conductor posts (50) have the aspect ratio Rasp (height/minimum diameter) of not less than 4 and the minimum diameter exceeding 30 μm, and the aspect ratio Rasp of external conductor posts50a, which are positioned at external portions of the low elastic modulus layer (40), is greater than or equal to the aspect ratio Rasp of internal conductor posts (50b), which are positioned at internal portions of the low elastic modulus layer (40).

REFERENCES:
patent: 4736521 (1988-04-01), Dohya
patent: 5375042 (1994-12-01), Arima et al.
patent: 5459368 (1995-10-01), Onishi et al.
patent: 5509203 (1996-04-01), Yamashita
patent: 5699613 (1997-12-01), Chong et al.
patent: 5916453 (1999-06-01), Beilin et al.
patent: 6339197 (2002-01-01), Fushie et al.
patent: 6384344 (2002-05-01), Asai et al.
patent: 6428942 (2002-08-01), Jiang et al.
patent: 6526654 (2003-03-01), Song et al.
patent: 6847527 (2005-01-01), Sylvester et al.
patent: 2006/0180341 (2006-08-01), Kariya et al.
patent: 2007/0085203 (2007-04-01), Kariya et al.
patent: 58-028848 (1983-02-01), None
patent: 05-047842 (1993-02-01), None
patent: 2001-036253 (2001-02-01), None
patent: 2001-298272 (2001-10-01), None
patent: 2003-077920 (2003-03-01), None
patent: 2003-133477 (2003-05-01), None
U.S. Appl. No. 11/415,117, filed May 2, 2006, Kariya et al.
U.S. Appl. No. 11/778,989, filed Jul. 17, 2007, Kariya et al.

Affiliated with

Also associated with

Rating

Multilayer printed wiring board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer printed wiring board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer printed wiring board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4125804