Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-08-27
2008-11-25
Bui, Hung S (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S760000
Reexamination Certificate
active
07457129
ABSTRACT:
There is provided a multilayer printed wiring board including semiconductor element therewithin, which can realize high density wiring. A multilayer printed wiring board1includes a first printed wiring board10having a semiconductor element2mounted on a wiring pattern12, a second printed wiring board21laminated on the wiring pattern12through a first insulating layer20, a third printed wiring board31laminated on the second printed wiring board21through a second insulating layer30, and a space region penetrating through the first insulating layer20and the second printed wiring board21in the thickness direction and adapted so that the semiconductor element2can be accommodated therewithin. The second printed wiring board21includes first bumps26penetrating through the first insulating layer20in the thickness direction, and second bumps28penetrating through the insulating layer27in the thickness direction, and the bumps26and28each have a diameter of the maximum bottom surface ranging from 50 μm to 200 μm.
REFERENCES:
patent: 5686702 (1997-11-01), Ishida
patent: 6324067 (2001-11-01), Nishiyama
patent: 2002/0192870 (2002-12-01), Ikeda et al.
patent: 2006/0021791 (2006-02-01), Sunohara et al.
patent: 2008/0151520 (2008-06-01), Sakamoto et al.
patent: 2005-39094 (2005-02-01), None
Gunji Tomoyasu
Hiramori Hidetoshi
Ikezawa Yoshiyuki
Matsuura Katsuhiko
Sunada Takeshi
Birch & Stewart Kolasch & Birch, LLP
Bui Hung S
Clover Electronics Co., Ltd.
LandOfFree
Multilayer printed wiring board does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multilayer printed wiring board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer printed wiring board will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4028652