Multilayer printed wiring board

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S760000

Reexamination Certificate

active

07457129

ABSTRACT:
There is provided a multilayer printed wiring board including semiconductor element therewithin, which can realize high density wiring. A multilayer printed wiring board1includes a first printed wiring board10having a semiconductor element2mounted on a wiring pattern12, a second printed wiring board21laminated on the wiring pattern12through a first insulating layer20, a third printed wiring board31laminated on the second printed wiring board21through a second insulating layer30, and a space region penetrating through the first insulating layer20and the second printed wiring board21in the thickness direction and adapted so that the semiconductor element2can be accommodated therewithin. The second printed wiring board21includes first bumps26penetrating through the first insulating layer20in the thickness direction, and second bumps28penetrating through the insulating layer27in the thickness direction, and the bumps26and28each have a diameter of the maximum bottom surface ranging from 50 μm to 200 μm.

REFERENCES:
patent: 5686702 (1997-11-01), Ishida
patent: 6324067 (2001-11-01), Nishiyama
patent: 2002/0192870 (2002-12-01), Ikeda et al.
patent: 2006/0021791 (2006-02-01), Sunohara et al.
patent: 2008/0151520 (2008-06-01), Sakamoto et al.
patent: 2005-39094 (2005-02-01), None

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