Multilayer printed wiring board

Details Multilayer printed wiring board Multilayer printed wiring board

2002-03-13

2008-05-13

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S792000

Reexamination Certificate

active

07371974

ABSTRACT:
A multilayered printed circuit board includes a substrate and, as serially built up thereon, a conductor circuit and an interlaminar resin insulating layer in an alternate fashion and in repetition. The conductor circuits between which the interlaminar resin insulating layer is sandwiched are connected by a via-hole. The via-hole includes at least one of Cu, Ni, Pd, Co, W and their alloys. Via-holes in different level layers among the via-holes are formed so as to form the stack-via structure. At least one of the land diameters of the via-holes in different level layers is different from the land diameters of other via-holes in different level layers.

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