Multilayer printed wiring board

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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Details

174255, 174256, 361746, 257702, 257729, B32B 900

Patent

active

055629717

ABSTRACT:
A multilayer printed wiring board comprising a plurality of interlaminar insulating layers, a plurality of insulating circuit boards having circuits formed on the insulating substrates, and via holes for making electrical connection between two or more layers of circuits, wherein the difference between the glass transition point of an interlaminar insulating layer and that of the adjoining insulating substrate is not greater than 60.degree. C., is proof against exfoliation due to heat history of the board and has high reliability of insulation and through-hole connection.

REFERENCES:
patent: 3244795 (1966-04-01), Latimer
patent: 3654097 (1972-04-01), Degnan
patent: 4201616 (1980-05-01), Chellis et al.
patent: 4578308 (1986-03-01), Hani et al.
patent: 4640010 (1987-02-01), Brown
patent: 5068708 (1991-11-01), Newman
patent: 5088008 (1992-02-01), Takeyama et al.
patent: 5103293 (1992-04-01), Bonafina et al.

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