Multilayer printed-circuit substrate, wiring substrate and proce

Details Multilayer printed-circuit substrate, wiring substrate and proce Multilayer printed-circuit substrate, wiring substrate and proce

1995-06-05

1997-05-27

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Edge feature

428195, 428200, 428201, 428209, 428457, 428901, B32B 300

Patent

active

056330693

ABSTRACT:
In a multilayer printed-circuit substrate comprising a plurality of insulating resin layers, a plurality of metal-made electrically conductive circuits respectively laminated between the insulating resin layers and on the upper surface of the uppermost-positioned insulating resin layer and electrically conductive portions for respectively electrically connecting adjacent upper- and lower-positioned conductive circuits to each other, the insulating resin layers except at least the lowest-positioned insulating resin layer have flexibility, and blackening-treated films prepared by applying blackening treatment to the surface of the respective electrically conductive circuits are respectively provided between the upper surfaces of the conductive circuits and the insulating resin layers laminated thereon. Also, a wiring substrate capable of being subjected to plastic work, comprises a sheet-like insulating base material made of hydrophilic high molecules capable of being plasticized when absorbing water and capable of being hardened when being dried, an insulating resin layer laminated on a surface of said insulating base material, and a metal-made electrically conductive circuit fixed to the insulating base material through the insulating resin layer.

REFERENCES:
patent: 4687695 (1987-08-01), Hamby
patent: 4717439 (1988-01-01), Hadju et al.

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