Multilayer printed circuit board with epoxy resin and carboxylat

Etching a substrate: processes – Forming or treating electrical conductor article – Adhesive or autogenous bonding of self-sustaining preforms

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156153, 156295, B32B 712, B32B 2704, B32B 2738

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active

058740090

ABSTRACT:
A multilayered printed circuit board is produced by (a) forming a resin layer on an inner circuit substrate and abrading it to expose the circuit conductors, (b) contacting a copper foil having a layer of insulating adhesive composed of an epoxy resin, a carboxylic acid-containing acrylic or acrylonitrile-butadiene rubber, a curing agent and accelerator with the resin layer and exposed circuit conductors, (c) removing portions necessary for connection with the copper foil and insulating adhesive exposed to the holes by etching, (d) connecting the copper foil with circuits exposed to the holes and forming a surface circuit by processing the outer layer of the copper foil, and (e) repeating steps (a) to (d) to obtained a multilayered structure.

REFERENCES:
patent: 4511757 (1985-04-01), Ors et al.
patent: 4985751 (1991-01-01), Shiobara et al.
patent: 5006433 (1991-04-01), Yoyoka et al.
patent: 5053280 (1991-10-01), Takanezawa et al.
patent: 5104604 (1992-04-01), Gallo
patent: 5160783 (1992-11-01), Nemoto et al.
patent: 5571447 (1996-11-01), Ward et al.
WPAT accession No. 89-021205/03 for Japanese Patent No. 63-299148, Nitto Electric Ind KK, Dec. 1988.

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