Multilayer printed circuit board with domain partitioning

Electricity: electrical systems and devices – Miscellaneous

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174 685, H05K 116

Patent

active

047991283

ABSTRACT:
A multilayer printed circuit board included a plurality of substrates bonded together in which the surface area of each substrate is divided into equal surface areas in which each area may contain the same number and lengths of lines of conductive elements, monitor holes, plated-through holes and circuit components. Connecting pads mounted within each substrate and intersected by a plated-through hole are positioned adjacent the conductive elements within the substrate and are connected to the elements by connecting segments. The circuit components mounted on a surface of the circuit board have their lead elements connected by bridge members to a monitor hole for testing purposes, said bridge member being severable to isolate the circuit components. A method for manufacturing such a multilayer printed circuit board is likewise disclosed.

REFERENCES:
patent: 3395318 (1968-07-01), Laermer et al.
patent: 3447040 (1969-05-01), Denton, Jr.
patent: 3564115 (1971-02-01), Gribble
patent: 3777129 (1973-12-01), Mehia
patent: 3917984 (1975-11-01), Kongiet et al.
patent: 3939381 (1976-02-01), Meany
patent: 4029999 (1977-06-01), Neumann et al.
patent: 4030190 (1977-06-01), Varker
patent: 4063993 (1977-12-01), Burns
patent: 4290015 (1981-09-01), Labriola
patent: 4322778 (1982-03-01), Barbour et al.
patent: 4411719 (1983-10-01), Lindberg
patent: 4434321 (1984-02-01), Betts
patent: 4524239 (1985-06-01), Rouge
patent: 4675789 (1987-06-01), Kuwabara et al.
Patrick, R. M., "Flex Strip Transmission Line", IBM Tech. Discl. Bul., vol. 2, No. 6, Apr. 1960, p. 35.
Dougherty, W. E., "Eng. Change Technology Using Off-Set Holes for PCBs", IBM Tech. Discl. Bul., vol. 20, No. 11B, Apr. 1978.
Hubacher, E., "Partially Good Array Packaging Scheme", IBM Tech. Discl. Bul., vol. 24, No. 4, Sep. 1981, pp. 2101-2104.

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