Multilayer printed circuit board with cured and uncured resin la

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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Details

174258, 174259, 174252, H05K 103

Patent

active

061039772

ABSTRACT:
A printed circuit board assembly includes a first printed circuit board and a first component. The first printed circuit board includes a first cured unreinforced layer and a first dried, uncured, unreinforced layer. The first component includes a second dried, uncured, unreinforced layer. The first and second dried, uncured unreinforced layers are placed in contact prior to curing. During curing, the dried, uncured, unreinforced layers form a unitary cured layer which binds and supports the PCB assembly without the need for a fiber reinforced resin layer. Elimination of the fiber reinforced layer provides a reduction in the overall thickness of the PCB assembly.

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