Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2009-10-06
2010-12-28
Chambliss, Alonzo (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S773000, C257SE33021, C438S107000
Reexamination Certificate
active
07859106
ABSTRACT:
A core substrate using paste bumps, the core substrate including a first paste bump board having a plurality of first paste bumps joined to a surface thereof; a second paste bump board having a plurality of second paste bumps facing the first paste bumps joined thereto; and an insulation element placed between the first paste bump board and the second paste bump board. In the core substrate, the first paste bumps and the second paste bumps are electrically interconnected.
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Mok Jee-Soo
Oh Yoong
Park Dong-Jin
Ryu Chang-Sup
Seo Byung-Bae
Chambliss Alonzo
Samsung Electro-Mechanics Co. Ltd.
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