Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-07-04
2011-12-06
Nguyen, Hoa C (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S795000, C361S762000, C361S729000, C361S735000
Reexamination Certificate
active
08072768
ABSTRACT:
The invention relates to a multilayer printed circuit board structure comprising a stack of plurality of electrically insulating and/or electroconductive layers and at least one passive or active electrical component arranged inside the stack of layers, the component extending laterally only in part of the surface extension of the stack of layers. The invention also relates to a passive or active electrical component mounted on the stack, to an associated wiring, and to a corresponding production method. According to the invention, the insert is embedded between two electrically insulating liquid resin layers or prepreg layers extending over the entire surface and covering the insert on both sides, the insert being surrounded by a resin material that is liquefied by compression or lamination of the structure. The invention structure can be used in printed circuit board technology.
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Gottwald Thomas
Ockenfuss Ulrich
Nguyen Hoa C
Schweizer Electronic AG
Shlesinger & Arkwright & Garvey LLP
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