Multilayer printed circuit board structure comprising an...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S795000, C361S762000, C361S729000, C361S735000

Reexamination Certificate

active

08072768

ABSTRACT:
The invention relates to a multilayer printed circuit board structure comprising a stack of plurality of electrically insulating and/or electroconductive layers and at least one passive or active electrical component arranged inside the stack of layers, the component extending laterally only in part of the surface extension of the stack of layers. The invention also relates to a passive or active electrical component mounted on the stack, to an associated wiring, and to a corresponding production method. According to the invention, the insert is embedded between two electrically insulating liquid resin layers or prepreg layers extending over the entire surface and covering the insert on both sides, the insert being surrounded by a resin material that is liquefied by compression or lamination of the structure. The invention structure can be used in printed circuit board technology.

REFERENCES:
patent: 3763404 (1973-10-01), Aird
patent: 5401688 (1995-03-01), Yamaji et al.
patent: 5426263 (1995-06-01), Potter et al.
patent: 5851854 (1998-12-01), Haghiri-Tehrani et al.
patent: 5888624 (1999-03-01), Haghiri et al.
patent: 5970346 (1999-10-01), Liaw
patent: 6538210 (2003-03-01), Sugaya et al.
patent: 2003/0189246 (2003-10-01), Iwaki et al.
patent: 2003/0219956 (2003-11-01), Mori et al.
patent: 2004/0169086 (2004-09-01), Ohta et al.
patent: 2005/0140007 (2005-06-01), Jobetto
patent: 2005/0179122 (2005-08-01), Okawa et al.
patent: 2006/0017133 (2006-01-01), Oi et al.
patent: 2007/0119617 (2007-05-01), Hayashi et al.
patent: 3125518 (1982-04-01), None
patent: 690 31 350 (1991-11-01), None
patent: 196 27 543 (1997-11-01), None
patent: 3574207 (1993-12-01), None
patent: 1 230 680 (2001-05-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Multilayer printed circuit board structure comprising an... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer printed circuit board structure comprising an..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer printed circuit board structure comprising an... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4267156

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.