Multilayer printed circuit board structure

Details Multilayer printed circuit board structure Multilayer printed circuit board structure

1983-12-22

1986-05-27

Kucia, R. R.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

361387, 361414, 427 96, 428408, 428901, H05K 103

Patent

active

045916594

ABSTRACT:
A composite printed circuit board structure including multiple layers of graphite interleaved with layers of a dielectric material, such as a polytetrafluoroethylene (PTFE) and woven glass laminate. Some of the dielectric layers are copper clad, and at least some of the graphite layers are positioned in close proximity to the copper cladding layers, to provide good heat dissipation properties. The PTFE provides a desirably low dielectric constant and the graphite also provides good mechanical strength and a low or negative coefficient of thermal expansion, to permit matching of the coefficient with that of chip carriers used to mount components on the circuit board.

REFERENCES:
patent: 3952231 (1976-04-01), Davidson et al.
patent: 4054939 (1977-10-01), Ammon
patent: 4294877 (1981-10-01), Graham
patent: 4318954 (1952-03-01), Jensen
patent: 4327126 (1982-04-01), Ogden
patent: 4456712 (1984-06-01), Christie et al.
patent: 4464704 (1984-08-01), Huie et al.
patent: 4472762 (1984-09-01), Spinelli et al.
patent: 4526835 (1985-07-01), Takahashi et al.

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