Multilayer printed circuit board, method of producing multilayer

Details Multilayer printed circuit board, method of producing multilayer Multilayer printed circuit board, method of producing multilayer

1997-05-12

2000-01-04

Jones, Deborah

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

174255, 174258, 428901, B32B 300

Patent

active

060107685

ABSTRACT:
It is to provide a multilayer printed circuit board having excellent resolution, interlaminar insulation property and resistance to cool-heat shock without forming unevenness on the surface and lowering peel strength even if the thickness of the resin insulating layer is thin. The invention proposes a multilayer printed circuit board comprising an upper conductor circuit layer, a lower conductor circuit layer and a resin insulating layer electrically insulating both the conductor circuit layers, in which the resin insulating layer is a composite layer comprised of an layer made from a heat-resistant resin hardly soluble in acid or oxidizing agent as a lower layer and an adhesive layer for electroless plating made from a heat-resistant resin as an upper layer, and if necessary, a resin is filled in a concave portion created between conductor insulating circuits of the lower layer so as to render the surface into the same plane as the surface of the conductor circuit.

REFERENCES:
patent: 4574371 (1986-03-01), Takemura et al.
patent: 4752499 (1988-06-01), Enomoto
patent: 4927983 (1990-05-01), Jones et al.
patent: 5021472 (1991-06-01), Enomoto
patent: 5055321 (1991-10-01), Enomoto et al.
patent: 5227012 (1993-07-01), Brandli et al.
patent: 5344893 (1994-09-01), Asai et al.
patent: 5447996 (1995-09-01), Asai et al.
patent: 5519177 (1996-05-01), Wang et al.
patent: 5589255 (1996-12-01), Enomoto et al.
patent: 5688583 (1997-11-01), Asai et al.
patent: 5741575 (1998-04-01), Asai et al.
English Language Abstract of JP 05-67881.
English Language Abstract of JP 05-7080.
English Language Abstract of JP 07-30259.
English Language Abstract of JP 05-299837.
English Language Abstract of JP 02-188992.
English Language Abstract of JP 51-22065.
English Language Abstract of JP 60-62193.
English Language Abstract of JP 58-147097.
International Search Reports (English and Japanese language versions).

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