Multilayer printed circuit board laminated with unreinforced res

Details Multilayer printed circuit board laminated with unreinforced res Multilayer printed circuit board laminated with unreinforced res

1997-05-02

1999-09-07

Breneman, Bruce

Etching a substrate: processes

Forming or treating electrical conductor article

216105, 156630, 174255, H01B 1300

Patent

active

059482800

ABSTRACT:
A printed circuit board laminated without reinforced binder and a method for its fabrication are disclosed. The invention makes possible reduced board thickness and increased layer count without excessive reduction in the thickness of core material. Laser or plasma drilling can be performed with increased control. Straighter traces, higher trace resolution and higher signal velocity with reduced distortion are made possible.

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