Multilayer printed circuit board laminated with unreinforced res

Details Multilayer printed circuit board laminated with unreinforced res Multilayer printed circuit board laminated with unreinforced res

1994-10-05

1998-04-14

Kincaid, Kristine L.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174252, H01R 909

Patent

active

057394768

ABSTRACT:
A printed circuit board laminated without reinforced binder. The invention makes possible reduced board thickness and increased layer count without excessive reduction in the thickness of core material. Laser or plasma drilling can be performed with increased control. Straighter traces, higher trace resolution and higher signal velocity with reduced distortion are made possible.

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McGraw-Hill Encyclopedia of Science & Technology, vol. 14, pp. 301-303, 1992.
"IBM Yasu's SLC/FCA: Leaps and Bounds to MCM," International Photopolymers news, vol. 2, No. 1, Winter 1994.

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