Multilayer printed circuit board including first and second...

Details Multilayer printed circuit board including first and second... Multilayer printed circuit board including first and second...

2006-06-13

2006-06-13

Williams, Alexander Ocar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257SE29015, C257SE25017, C257SE23013, C257SE21575, C257S774000, C257S773000, C257S680000, C257S668000, C257S698000, C257S700000, C257S701000, C257S758000

Reexamination Certificate

active

07061094

ABSTRACT:
A multilayer printed circuit board (PCB) includes a substrate; a ground layer having edges which define a gap portion, the ground layer being provided on a bottom face of the substrate; and at least two signal traces and provided on a top face of the substrate so as to straddle the gap portion and so as to be substantially parallel to each other. The multilayer PCB also includes at least one ground trace provided between the at least two signal traces and on the top face of the substrate so as to straddle the gap portion.

REFERENCES:
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patent: 4245356 (1981-01-01), Hallford
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patent: 5348792 (1994-09-01), Hattori et al.
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patent: 5628031 (1997-05-01), Kikinis et al.
patent: 6856131 (2005-02-01), Miyazawa et al.
patent: 2002/0141168 (2002-10-01), Tsukahara
patent: 7-321463 (1995-12-01), None
patent: 11-298150 (1999-10-01), None
patent: 2000-323905 (2000-11-01), None
patent: 2004-64174 (2004-02-01), None

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