Multilayer printed circuit board, in particular, for high-freque

Details Multilayer printed circuit board, in particular, for high-freque Multilayer printed circuit board, in particular, for high-freque

1992-01-06

1994-08-09

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174262, 174264, 361784, H05K 100

Patent

active

053368550

ABSTRACT:
The invention relates to a multilayer printed circuit board, in particular, for high-frequency operation, having least an outer, plane dielectric layer for accommodating interconnection paths of equal cross-section and component as well as further alternately provided metallic and dielectric layers for forming a reference earth and for the voltage supply to said interconnection paths and components via plated-through holes. In order to obtain a plane surface for the interconnection paths and predetermined areas on the printed circuit board, which areas have different characteristic impedances when interconnection paths having the same cross-section are used, at least the first metal layer comprises at least one window and the subsequent metal layer has a metal island corresponding to the area of the window, which island is connected to the reference earth via a buried plated-through hole, and the characteristic impedance of the interconnection paths is a function of the resulting thickness of the effective dielectric layers the number of which is increased in the area of the window.

REFERENCES:
patent: 4641425 (1987-02-01), Dubuisson
patent: 4803595 (1987-11-01), Kraus et al.
patent: 4811082 (1989-03-01), Jacobs et al.
patent: 5012047 (1991-04-01), Dohya
patent: 5072075 (1991-12-01), Lee et al.

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