Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent
1996-02-21
1998-04-07
Evans, Elizabeth
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
428210, 428901, B32B 900
Patent
active
057362343
ABSTRACT:
A multilayer printed circuit board has a substrate, an inner interconnection layer formed on each surface of the substrate, and an outer interconnection layer overlying each inner interconnection layer. The inner interconnection layer is formed of a copper sheet and two latticed metal films made of a metal having a low thermal expansion coefficient and bonded to boty surfaces of the copper sheet under application of pressure. The area ratio of exposed portions of the copper sheet to the whole surface of the interconnection layer is between 25 and 75%. Thermal expansion coefficient of the resultant circuit board is lowered to be close to the thermal expansion coefficient of a LSI, thereby obtaining reliability of a electronic product due to a low thermal stress. The metallic film is made of Kovar or Invar.
REFERENCES:
patent: 3958317 (1976-05-01), Peart
patent: 4189524 (1980-02-01), Lazzari
patent: 4886686 (1989-12-01), Muenstedt
patent: 5232548 (1993-08-01), Ehrenberg
"Surface Mount Technology", Jun. 1993, pp. 54-55.
Evans Elizabeth
NEC Corporation
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