Multilayer printed circuit board formation

Details Multilayer printed circuit board formation Multilayer printed circuit board formation

1989-12-05

1991-12-17

Ryan, Patrick J.

Stock material or miscellaneous articles

Composite

Of silicon containing

428901, 524188, B32B 900

Patent

active

050734563

ABSTRACT:
Multilayer printed circuit boards having a number of through-holes are formed employing intermediate layers in bonding copper circuitry to an insulating layer.

REFERENCES:
patent: 3348990 (1967-10-01), Zimmerman et al.
patent: 3644166 (1972-02-01), Gause
patent: 3984598 (1976-10-01), Sarazin et al.
patent: 4482476 (1984-11-01), Yoshimura et al.
patent: 4499152 (1985-02-01), Green et al.
patent: 4689085 (1987-08-01), Plueddemann

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