Electricity: electrical systems and devices – Miscellaneous
Patent
1987-09-18
1989-03-21
Kucia, R. R.
Electricity: electrical systems and devices
Miscellaneous
174 685, 428360, 428901, H05K 103
Patent
active
048149454
ABSTRACT:
A multilayer printed circuit board in which multiple layers of a composite material, fabricated by the lay-up of an aramid fiber tape, are employed to provide a circuit board with a desired coefficient of thermal expansion. Tape lay-up of aramid fibers provides a composite layer having a lower thermal coefficient of expansion than a composite layer fabricated from woven aramid fibers. Degradation in the tensile modulus of elasticity caused by the over and under characteristics of woven fabrics is also eliminated by tape lay-up, thus providing a circuit board with better mechanical strength. In addition, tape lay-up reduces the amount of resin required to fabricate the circuit board and eliminates the need for twisting the aramid fibers into yarns and then weaving the yarns, thus reducing the cost of the circuit board.
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Goldstein Sol L.
Kucia R. R.
Steinberger James M.
TRW Inc.
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