Multilayer printed circuit board and process for producing and u

Details Multilayer printed circuit board and process for producing and u Multilayer printed circuit board and process for producing and u

1996-10-28

1999-11-09

Jones, Deborah

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428220, 428416, 428418, 428901, 174259, B32B 900, H05K 102

Patent

active

059810416

ABSTRACT:
A multilayer printed circuit board is obtained by impregnating a base material with a thermosetting resin in to form a prepreg; applying an undercoating agent comprising a terminal-bifunctional linear epoxy resin having an average epoxy equivalent of 450 to 6,000, together with at least one of 2-undecylimidazole, 1-cyanoethy1-2-undecylimidazole or 2,4-diamino-6{2'-undecyl-imidazole(1')}ethyl-s-triazine, or the aforementioned components together with an aromatic polyamine, to at least one circuit side of an interlayer circuit board on at least one side of which a circuit has been formed; and laying the prepreg on at least one side of the undercoating agent-applied interlayer circuit board and subjecting them to laminating.

REFERENCES:
patent: 4767805 (1988-08-01), Tada et al.
patent: 5075159 (1991-12-01), Koyama et al.
patent: 5098781 (1992-03-01), Minnick et al.
patent: 5270493 (1993-12-01), Inoue et al.
patent: 5308565 (1994-05-01), Weber et al.

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