Multilayer printed circuit board and process for producing and u

Details Multilayer printed circuit board and process for producing and u Multilayer printed circuit board and process for producing and u

1996-11-07

1998-11-17

Lam, Cathy F.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

4283202, 4283215, 428323, 428413, 4284258, 428901, 428344, 1563073, B32B 300

Patent

active

058373551

ABSTRACT:
A process for producing a multilayer printed circuit board, comprising the steps of: impregnating a thermosetting resin in a base material to form a prepreg, applying a thermosetting epoxy resin undercoating agent comprising dicyandiamide and a micro-capsulated imidazole compound to at least one side of an interlayer circuit board on at least one side of which circuit has been formed, heating the applied undercoating agent to dry or semi-cure the undercoating agent, and laying the prepreg on at least one side of the dried or semi-cured undercoating agent-applied interlayer circuit board and subjecting them to laminating press.

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