Multilayer printed circuit board and method of producing the sam

Details Multilayer printed circuit board and method of producing the sam Multilayer printed circuit board and method of producing the sam

1983-04-14

1989-11-28

Miska, Vit W.

Electricity: electrical systems and devices

Miscellaneous

H05K 111

Patent

active

048841706

ABSTRACT:
A multilayer printed circuit board having a plurality of printed circuit boards each having opposite surfaces respectively provided with an electric source or ground layer and a signal circuit layer. The plurality of printed circuit boards is stacked through adhesive layers such that the electric source or ground layer and the signal circuit layer are alternately disposed, the characteristic impedance of each signal circuit layer is given by a thickness and material of each of the substrate and the adhesive sheet disposed between the signal circuit layer and one of two electric source or ground layers adjacent to the signal circuit layer and between the same signal circuit layer and the other electric source or ground layer.

REFERENCES:
patent: 3102213 (1963-08-01), Bedson et al.
patent: 3760091 (1973-09-01), Cannizzaro et al.
patent: 3795047 (1974-03-01), Abolafia et al.
patent: 3867759 (1975-02-01), Siefker
"Reinforcement of Printed Circuits", Archer et al., IBM Tech. Discl. Bull., vol. 13, No. 8, Jan. 71, (2296).
"Multilayer Circuit Board", Cannizzaro et al., IBM Tech. Discl. Bull., vol. 13, No. 7, Dec. 70, (2075).
"Plating Thru-Holes in Circ. Boards", . . . Schuessler et al., IBM Tech. Discl. Bull., vol. 13, No. 7, Dec. 70, (1831).
"Multilayer Printed Circ. Panel", Haddad, IBM Tech. Discl. Bull., vol. 12, No. 8, Jan. 70, (1191).

Affiliated with

Also associated with

Rating

Multilayer printed circuit board and method of producing the sam does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer printed circuit board and method of producing the sam, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer printed circuit board and method of producing the sam will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-585824