Multilayer printed circuit board and method for fabricating same

Details Multilayer printed circuit board and method for fabricating same Multilayer printed circuit board and method for fabricating same

1991-09-24

1995-09-19

Kincaid, Kristine L.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174262, 174265, 174266, 361784, 361792, 361795, H05K 100

Patent

active

054517214

ABSTRACT:
A multilayer printed circuit board and a corresponding fabrication method are disclosed, which circuit board achieves a relatively high degree of wiring density and a relatively high degree of wiring design freedom. These advantages are obtained in the inventive printed circuit board by electrically connecting power conductors or ground conductors using through holes. On the other hand, signal conductors in any two adjacent signal wiring layers are electrically connected using via holes extending only through an intervening electrically insulating layer. Preferably, the electrically insulating layer is a layer of photosensitive resin and the via holes are formed using conventional photolithographic techniques.

REFERENCES:
patent: 4673773 (1987-06-01), Nakano et al.
patent: 4710854 (1987-12-01), Yamada et al.
patent: 4882454 (1989-11-01), Peterson et al.
patent: 4904968 (1990-02-01), Theus

Affiliated with

Also associated with

Rating

Multilayer printed circuit board and method for fabricating same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer printed circuit board and method for fabricating same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer printed circuit board and method for fabricating same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1829498