Multilayer printed circuit board and high-frequency circuit devi

Details Multilayer printed circuit board and high-frequency circuit devi Multilayer printed circuit board and high-frequency circuit devi

1997-05-20

1998-10-27

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361748, 361750, 361751, 361753, 361788, 361791, 361792, 361794, 361795, 361736, 333 1, 333246, 333202, 333206, 439 59, 439 66, 439 74, 4395415, 439591, 439 67, 174259, 174254, 174262, 174266, H05K 111

Patent

active

058285555

ABSTRACT:
A multilayer printed-circuit board includes at least one inner-layer signal line, first and second ground layers between which the inner-layer signal line is sandwiched via a frame member made of an insulating material in a thickness direction of the multilayer printed-circuit board, and metallic wall members which are provided on inner walls of slits formed in the frame member and extending along the inner-layer signal line. The first and second ground layers and the metallic wall members shielding the inner-layer signal line.

REFERENCES:
patent: 5057804 (1991-10-01), Sogo et al.
patent: 5214571 (1993-05-01), Dahlgren et al.
patent: 5680080 (1997-10-01), Nishiyama et al.

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