Multilayer printed circuit board

Details Multilayer printed circuit board Multilayer printed circuit board

1987-04-28

1988-07-05

Kucia, R. R.

Electricity: electrical systems and devices

Miscellaneous

174 685, 174117PC, 428422, 428901, H05K 114

Patent

active

047559110

ABSTRACT:
A multilayer printed circuit board is provided comprising a plurality of printed circuit boards laminated together, each board being separated from an adjacent board by a layer of a dielectric of porous, expanded polytetrafluoroethylene (PTFE). The dielectric layer may have an adhesive on its surface(s) affixed as a layer or in a pattern of dots. Alternatively, an adhesive may be impregnated within the pores of the porous dielectric. In a preferred embodiment, the dielectric has additional openings or through holes in it, in additon to the pores of the porous dielectric.

REFERENCES:
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patent: 3467569 (1969-09-01), Weber et al.
patent: 3486961 (1969-12-01), Adams
patent: 4423282 (1983-12-01), Suzuki et al.
patent: 4443657 (1984-04-01), Hill et al.
patent: 4591659 (1986-05-01), Leibowitz
patent: 4640866 (1987-02-01), Suzuki
patent: 4680220 (1987-07-01), Johnson
patent: 4689110 (1987-08-01), Leibowitz
The Journal of Teflon, Du Pont pamphlet, published at Wilminton, Del., pp. 1 to 12.

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