Multilayer printed circuit board

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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Details

428256, 428255, 428416, B32B 900

Patent

active

053728726

ABSTRACT:
A multilayer printed circuit board reducing cross-talk noise between signal interconnection layers and between through-holes for connecting the signal interconnection layers is disclosed. The multilayer printed circuit board has printed substrates each formed thereon an interconnection layer, and prepreg sandwiched therebetween. The prepreg comprises an reinforcement lattice cloth formed of rovings of a electroconductive material maintained at a ground potential and a dielectric resin impregnated thereinto and forming a dielectric solid layer having through-holes penetrating therethrough. The electroconductive reinforcement lattice cloth functions as a ground layer between signal interconnection layers and between through-holes . The rovings may be of a metal or a semiconductive material such as carbon fiber. The multilayer printed circuit board is superior in heat resistance, dimensional stability and mechanical strength.

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