Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2006-01-24
2011-10-25
Norris, Jeremy (Department: 2835)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C361S792000
Reexamination Certificate
active
08044304
ABSTRACT:
A multilayer printed circuit board is characterized in that circuit boards1and2and a circuit board3are laminated alternately to form a multilayer body using a simultaneous lamination method, the circuit boards1and2including a film-, thin plate-, or sheet-like insulating substrate11made of a thermosetting resin containing any one of epoxy resin, bismaleimide/triazine resin, and allylic polyphenylene ether resin as a major component, the circuit board3including a film-, thin plate-, or sheet-like insulating substrate21made of a thermoplastic resin containing a polyaryl ketone resin and amorphous polyether imide resin having a crystal-fusing peak temperature of 260° C. or more. By the present invention, it is possible to provide a multilayer printed circuit board which has small fusion or flow deformation at the time of simultaneous lamination, which does not have unevenness in positional precision in the lamination direction, which has no need for the processes to be readjusted, and which has high reliability in interlayer electrical connection.
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Ryo Enomoto, “All Layer IVH Printed Wiring Board Using Single Step Laminating Process”, Electronics Packaging Academic Journal, Japan Institute of Electronic Packaging, Nov. 2000, vol. 3(7),pp. 544-547.
Shuji Maeda et al., “A New Material for Simultaneous Multi-Layer and Lamination Process with any Layer IVH”, MES 2004 14th Microelectronics Symposium Collected Papers, Japan Institute of Electronics Packaging, Oct. 14, 2004, pp. 341-344.
Mitsubishi Plastics Inc.
Norris Jeremy
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
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