Multilayer printed circuit board

Details Multilayer printed circuit board Multilayer printed circuit board

2008-02-28

2010-10-12

Dinh, Tuan T (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S258000, C174S260000, C361S764000, C361S794000, C361S795000

Reexamination Certificate

active

07812262

ABSTRACT:
The objective of present invention is to provide an electroplating solution capable of forming the upper face of a via-hole and the upper face of a conductor circuit in the same layer in approximately the same plane at the time of manufacturing a multilayer printed circuit board. The electroplating solution of the present invention is characterized by containing 50 to 300 g/L of copper sulfate, 30 to 200 g/L of sulfuric acid, 25 to 90 mg/L of chlorine ion, and 1 to 1000 mg/L of an additive comprising at least a leveling agent and a brightener.

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