Multilayer printed circuit board

Details Multilayer printed circuit board Multilayer printed circuit board

1989-11-08

1991-09-10

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including variation in thickness

428209, 428901, 361397, B32B 900

Patent

active

050472798

ABSTRACT:
A multilayer printed circuit board comprising a laminate of at least one glass fiber nonwoven cloth layer impregnated with thermosetting resin and glass fiber woven cloth layers impregnated with thermosetting resin, the laminate having a pair of V-cut grooves formed therein so that only the glass fiber nonwoven cloth layer remains uncut whereby the multilayer printed circuit board can be divided at the uncut glass fiber nonwoven cloth layer along the V-cut grooves into a plurality of printed circuit board portions which can be mounted having a practical size.

REFERENCES:
patent: 4614559 (1986-09-01), Shirasawa et al.
patent: 4886699 (1989-12-01), Carroll et al.
Technical Digest No. 4, W. J. Gyurk, "Break Apart Laminated Substrates", Oct. 1966, p. 15.

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