Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2009-01-07
2010-11-30
Dinh, Tuan T (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S760000, C361S792000, C361S794000
Reexamination Certificate
active
07843703
ABSTRACT:
According to one embodiment, a multilayer printed circuit board having a plurality of wiring layers and an electronic component mounted thereon, includes a spiral wire including a path in a substantial spiral shape configured with a printed wire section of a substantial loop shape provided on each of at least two wiring layers of the plurality of wiring layers, and a plug provided on each wiring layer arranged between a top wiring layer which is a wiring layer on a top on which the printed wire section of a substantial loop shape is provided and a bottom wiring layer which is a wiring layer on a bottom on which the printed wire section of a substantial loop shape is provided.
REFERENCES:
patent: 6549112 (2003-04-01), Gallina et al.
patent: 6759937 (2004-07-01), Kyriazidou
patent: 7375609 (2008-05-01), Suzuki et al.
patent: 03-106097 (1991-05-01), None
patent: 07-19325 (1995-03-01), None
patent: 2001-077538 (2001-03-01), None
patent: 2004-022735 (2004-01-01), None
patent: 2005-085966 (2005-03-01), None
patent: 2005-340733 (2005-12-01), None
patent: WO 2006/137248 (2006-12-01), None
Japanese Patent Application No. 2008-145181 Notice of Reasons for Rejection mailed Mar. 24, 2009 (English translation).
Blakely , Sokoloff, Taylor & Zafman LLP
Dinh Tuan T
Kabushiki Kaisha Toshiba
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