Multilayer printed circuit board

Details Multilayer printed circuit board Multilayer printed circuit board

2006-08-01

2006-08-01

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000

Reexamination Certificate

active

07084355

ABSTRACT:
A multilayer printed circuit board is provided in which microcracks or metallic migration is mitigated when a Resin Fill Plated Through Hole (RFP) is arranged near the edge thereof. The multilayer printed circuit board includes an inner layer having an RFP, outer layers, RFP lands, and conductor layers. The conductor layers are positioned over the RFP lands and the outer edges of the conductor layers extends outward further than the outer edges of the RFP lands. When the multilayer printed circuit board is heated, a stress is generated in and near the RFP. The conductor layers positioned so as to cover the RFP lands, exert a reaction against the stress to suppress generation of microcracks in the multilayer printed circuit board and thereby mitigate metallic migration in the board.

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