Multilayer printed circuit board

Details Multilayer printed circuit board Multilayer printed circuit board

2011-06-07

2011-06-07

Dinh, Tuan T (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S763000, C361S766000, C361S795000

Reexamination Certificate

active

07957154

ABSTRACT:
A multilayer printed circuit board, wherein, on a resin-insulating layer that houses a semiconductor element, another resin-insulating layer and a conductor circuit are formed with conductor circuits electrically connected through a via hole, wherein a electromagnetic shielding layer is formed on a resin-insulating layer surrounding a concave portion for housing a semiconductor element or on the inner wall surface of the concave portion, and the semiconductor element is embedded in the concave portion.

REFERENCES:
patent: 7023073 (2006-04-01), Mano
patent: 7348662 (2008-03-01), Miyazaki et al.
patent: 1543297 (2004-11-01), None
patent: 2001-274034 (2001-10-01), None
patent: 2001-339165 (2001-12-01), None
patent: 2002-16327 (2002-01-01), None
patent: 2002-50874 (2002-02-01), None
patent: 2004-319605 (2004-11-01), None

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