Multilayer printed circuit board

Details Multilayer printed circuit board Multilayer printed circuit board

1996-01-25

1998-03-10

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361792, 361780, 174255, 174262, 174266, H05K 346

Patent

active

057268630

ABSTRACT:
A high-density multilayer printed circuit board is provided such that crosstalk noise between through holes is avoided and wiring efficiency is increased. Power supply through holes which connect to power supply pins of component parts are combined to make room for via holes in certain portions of the multilayer printed circuit board. These power supply through holes are subsequently restored into their original form. This permits via holes to exist at certain locations so that certain wiring layers can be interconnected. Additionally, by restoring the power supply through holes, crosstalk noise is reduced as the rear side of the multilayer printed circuit board is approached. Finally, dummy power supply lines can be provided to further reduce crosstalk noise. These dummy power supply lines are not connected to power supply pins of the component parts.

REFERENCES:
patent: 4984132 (1991-01-01), Sakurai et al.

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