Multilayer printed circuit

Details Multilayer printed circuit Multilayer printed circuit

1995-06-07

1998-02-10

Lusignan, Michael

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

156277, 252512, 427 97, 427265, 427282, 427294, B05D 512

Patent

active

057166633

ABSTRACT:
Methods for fabricating single and multilayer printed boards which employ electronically conductive adhesive compositions are provided. The composition comprises a solder powder, a chemically protected cross-linking agent with fluxing properties and a reactive monomer or polymer as the principal components. The compositions may also comprise three or more of the following: a relatively high melting metal powder; solder powder; the active cross-linking agent which also serves as a fluxing agent; a resin; a reactive monomer or polymer; and a metal additive. Compositions comprising metal powder are ideally suited for creating the conductive paths and vias on printed circuits.

REFERENCES:
patent: 4503090 (1985-03-01), Brown et al.
patent: 4631111 (1986-12-01), Williston
patent: 4789411 (1988-12-01), Eguchi et al.
patent: 4870746 (1989-10-01), Klaser
patent: 4996005 (1991-02-01), Saito et al.
patent: 5139819 (1992-08-01), Frentzel et al.
patent: 5376403 (1994-12-01), Capote et al.

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