Multilayer printed board

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

361780, 361794, 361795, 174255, 174258, 174260, 174262, 333 12, 333246, H05K 116, H05K 103

Patent

active

059263776

ABSTRACT:
A multilayer printed board has at least a signal layer, a power source layer, and a ground layer that are formed one upon another with insulation material being interposed among the layers. The board is capable of reducing radio waves to be emitted from the board.
The board is provided with capacitors that are continuously or discretely formed at the edges of an overlapping pattern of the power source layer and ground layer, to pass a high-frequency current from the power source layer to the ground layer, thereby reducing the emission of radio waves.

REFERENCES:
patent: 5081561 (1992-01-01), Smith
patent: 5376759 (1994-12-01), Marx et al.
patent: 5523921 (1996-06-01), Van Lydegraf
patent: 5708400 (1998-01-01), Morris
patent: 5781110 (1998-07-01), Habeger, Jr. et al.
patent: 5793098 (1998-08-01), Uchida

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