Multilayer print circuit board having a blind hole in an insulat

Details Multilayer print circuit board having a blind hole in an insulat Multilayer print circuit board having a blind hole in an insulat

1996-04-24

2000-10-03

Kincaid, Kristine

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174255, H05K 102

Patent

active

061276332

ABSTRACT:
The present invention provides a multilayer print circuit board having at least an inner print circuit pattern and an outer print circuit pattern which are laminated on a substrate through an insulation layer and being electrically connected to each other through a blind hole provided in the insulation layer. The insulation layer is composed of a resin insoluble in an oxidization agent and inorganic powder dispersed in the resin. The inorganic powder is soluble in the oxidization agent. The surface of insulation layer and the wall of the blind hole are roughed by the oxidization agent before the outer print circuit pattern is formed on the surface of the insulation layer by plating, whereby the inorganic powder exposed to the oxidization agent is melted therein, resulting in the roughed surface of the insulation layer and the wall of the blind hole.

REFERENCES:
patent: 5055321 (1991-10-01), Enomoto et al.
patent: 5434751 (1995-07-01), Cole, Jr. et al.
patent: 5590461 (1997-01-01), Ishida
patent: 5652055 (1997-07-01), King et al.

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