Multilayer package with second layer via test connections

Details Multilayer package with second layer via test connections Multilayer package with second layer via test connections

1992-08-21

1996-04-30

Kincaid, Kristine L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257774, H01L 2302

Patent

active

055127100

ABSTRACT:
A package is disclosed that incorporates recessed test vias into a circuit substrate. The test vias are preferably formed at the time of substrate manufacture with little additional cost and offer access to electrical test points after hermetic sealing of the package without competing for lead sites on an otherwise crowded package exterior. The vias are preferably recessed below the surface of the substrate and may be backfilled with insulation to prevent unintended contact. Alternatively, the vias may be incorporated into the side of a package used for mounting to a motherboard, in which case the vias will be sealed at the time of package mounting. In still another instances, the vias may be left accessible or filled with a material that is easily removed for later test and service.

REFERENCES:
patent: 4221047 (1980-09-01), Naruen et al.
patent: 4617730 (1986-10-01), Geldermans et al.
patent: 4727410 (1988-02-01), Higgins
patent: 4855807 (1989-08-01), Yamaji et al.
patent: 4866507 (1989-09-01), Jacobs et al.
patent: 5041695 (1991-08-01), Olenick
patent: 5065228 (1991-11-01), Foster et al.
patent: 5239191 (1993-08-01), Sakumoto et al.
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5243220 (1993-09-01), Shibata et al.
patent: 5269880 (1993-12-01), Jolly et al.
patent: 5303119 (1994-04-01), Hilbrink
patent: 5317193 (1994-05-01), Watanabe
patent: 5351001 (1994-09-01), Kornrumpf et al.

Affiliated with

Also associated with

Rating

Multilayer package with second layer via test connections does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer package with second layer via test connections, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer package with second layer via test connections will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-630169