Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Patent
1992-06-04
1994-05-03
Jackson, Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
257786, 257691, 257665, 257697, 257678, 257774, H01L 2348, H01L 2946, H01L 2962, H01L 2964
Patent
active
053090241
ABSTRACT:
The present invention provides a multilayer ceramic package, which comprises a conductive layer, formed like a square layer, applying a power voltage V.sub.DD or a ground voltage V.sub.SS to a semiconductor device, and having a square hole in its central portion, a plurality of inner leads connected to the conductive layer at the inner portion of the conductive layer, and a plurality of outer leads connected to the conductive layer at the outer portion of the conductive layer, wherein if a first contact point between the inner lead and the conductive layer, a second contact point between the outer lead and conductive layer, a distance between adjacent two first contact points is C.sub.1, a distance between adjacent two second contact points is C.sub.2, a shortest distance from the first contact point to the second contact point is h, both C.sub.1 /h and C.sub.2 /h are 3/8 or less.
REFERENCES:
patent: 4698663 (1987-10-01), Subimoto et al.
patent: 4943845 (1990-07-01), Wilby
patent: 5066831 (1991-11-01), Spielberger et al.
patent: 5126828 (1992-06-01), Hatta et al.
patent: 5173766 (1992-12-01), Long et al.
IBM TDB vol. 30, No. 6 Nov. 1987 High Performance Multi-Chip Module pp. 437-439.
IEPS Proceedings (1988) M. A. Schmitt et al., "Current Distribution in Power and Ground Planes of a Multilayer Pin Grid Array Package" pp. 467-475.
IEEE (1989) 0569-5503/89/0384-U. A. Shrivastava et al., "Inductance Calculation and Optimal Pin Assignment for the Design of Pin Grid Array and Chip-Carrier Packages" pp. 384-391.
Arroyo T. M.
Jackson Jerome
Kabushiki Kaisha Toshiba
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