Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – Shaping against forming surface
Reexamination Certificate
2008-07-15
2008-07-15
Heitbrink, Tim (Department: 1791)
Plastic and nonmetallic article shaping or treating: processes
Mechanical shaping or molding to form or reform shaped article
Shaping against forming surface
C425S130000
Reexamination Certificate
active
07399442
ABSTRACT:
Disclosed herein are methods and systems for forming a plurality of multiple layer plastic articles. The methods and systems utilize shooting pot technology in combination with a combination of thermal control elements and in some instances, specialized flow bore geometries to control a thermal property and a flow parameter of selected polymeric material flowing through the system to mold the plurality of multiple layer plastic articles. Both the systems and methods are well suited for use to perform simultaneous flow injection or sequential flow injection to form the plurality of multiple layer plastic articles. The systems and methods described therein beneficially reduce the mold cavity pitch size for multiple layer molds used with systems having shooting pot technology to a mold cavity pitch size found on conventional monolayer molds to provide a plurality of multiple layer plastic articles having a cost similar to monolayer plastic articles.
REFERENCES:
patent: 4108956 (1978-08-01), Lee
patent: 4497621 (1985-02-01), Kudert et al.
patent: 4518344 (1985-05-01), Latreille et al.
patent: 4525134 (1985-06-01), McHenry et al.
patent: 4526821 (1985-07-01), McHenry et al.
patent: 4550043 (1985-10-01), Beck
patent: 4717324 (1988-01-01), Schad et al.
patent: 4775308 (1988-10-01), Schad et al.
patent: 4781954 (1988-11-01), Krishnakumar et al.
patent: 4863369 (1989-09-01), Schad et al.
patent: 4863665 (1989-09-01), Schad et al.
patent: 4950143 (1990-08-01), Krishnakumar et al.
patent: 5098274 (1992-03-01), Krishnakumar et al.
patent: 5131830 (1992-07-01), Orimoto et al.
patent: 5143733 (1992-09-01), Von Buren et al.
patent: 5232710 (1993-08-01), Miyazawa et al.
patent: 5510065 (1996-04-01), McFarlane
patent: 5556582 (1996-09-01), Kazmer
patent: 5662856 (1997-09-01), Wunderlich
patent: 5772933 (1998-06-01), Kotzab
patent: 5833899 (1998-11-01), Wunderlich
patent: 5914138 (1999-06-01), Swenson
patent: 5972258 (1999-10-01), Sicilia
patent: 6062846 (2000-05-01), Kalemba
patent: 6063325 (2000-05-01), Nahill et al.
patent: 6099780 (2000-08-01), Gellert
patent: 6187241 (2001-02-01), Swenson
patent: 6276914 (2001-08-01), Sicilia
patent: 6305923 (2001-10-01), Godwin et al.
patent: 6309207 (2001-10-01), Kalemba
patent: 6341954 (2002-01-01), Godwin et al.
patent: 6350401 (2002-02-01), Gellert et al.
patent: 6428727 (2002-08-01), Rees
patent: 6440350 (2002-08-01), Gellert et al.
patent: 6596213 (2003-07-01), Swenson
patent: 2001/0011415 (2001-08-01), Kalemba
patent: 2002/0140131 (2002-10-01), Ouellette
patent: 2002/0155236 (2002-10-01), Cahill et al.
patent: 2002/0182285 (2002-12-01), Godwin et al.
patent: 2002/0192401 (2002-12-01), Swenson
patent: 0374247 (1990-06-01), None
patent: 0688651 (1995-12-01), None
patent: 0768163 (1997-04-01), None
International Search Report for Application No. PCT/US05/24101, dated Jun. 28, 2006.
Roberts Ronald
Sabin Douglas
Swenson Paul
Heitbrink Tim
Kortec, Inc.
Lahive & Cockfield LLP
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