Multilayer molded plastic package design

Details Multilayer molded plastic package design Multilayer molded plastic package design

1997-05-21

1998-07-07

Ledynh, Bot L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 522, 361813, 257690, 257691, 257692, 257700, 257750, 257758, 257762, 257773, 257774, 257787, H01L 2302, H01L 2348, H01L 2352

Patent

active

057772657

ABSTRACT:
A multi-layer integrated circuit package which contains layers of dielectric that substantially reduce metal migration between the metal conductors of the package. The package has metal baseplates that are separated from a lead frame by a plurality of dielectric tapes. The integrated circuit is mounted to the baseplate which has a plurality of tabs that are connected to the lead frame of the package. The power or ground leads of the package are bonded to the corresponding baseplate through the tabs of the metal plate. The lead frame, metal baseplate and dielectric tapes all have center openings to provide clearance for the integrated circuit. The center opening of the tapes are such that the dielectric material extends beyond the ends of the baseplates and lead frame.

REFERENCES:
patent: 4320438 (1982-03-01), Ibrahim et al.
patent: 4839717 (1989-06-01), Phy et al.
patent: 4879588 (1989-11-01), Ohtsura et al.
patent: 4891687 (1990-01-01), Malik et al.
patent: 4972253 (1990-11-01), Palino et al.
patent: 4980034 (1990-12-01), Volfson et al.
patent: 5008734 (1991-04-01), Dutta et al.
patent: 5012386 (1991-04-01), McShane et al.
patent: 5158912 (1992-10-01), Kellerman et al.
patent: 5235209 (1993-08-01), Shimuzu et al.
patent: 5235211 (1993-08-01), Hamburgen
patent: 5258575 (1993-11-01), Beppu et al.
patent: 5264729 (1993-11-01), Rostoker et al.
patent: 5272590 (1993-12-01), Hernandez
patent: 5311057 (1994-05-01), McShane et al.
patent: 5331511 (1994-07-01), Lee et al.

Affiliated with

Also associated with

Rating

Multilayer molded plastic package design does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer molded plastic package design, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer molded plastic package design will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1208395