Multilayer microstrip wiring board with a semiconductor device m

Details Multilayer microstrip wiring board with a semiconductor device m Multilayer microstrip wiring board with a semiconductor device m

1994-04-06

1996-04-23

Lee, Benny T.

Wave transmission lines and networks

Long line elements and components

Strip type

361795, 257778, 257728, H01P 308, H01L 2158

Patent

active

055107583

ABSTRACT:
A semiconductor device includes a microstrip wiring board. The microstrip wiring board includes a substrate having a main surface, a ground conductor extending on the main surface of the substrate, a dielectric film extending on the ground conductor, and a metal wiring line extending on the dielectric film. A semiconductor chip is connected to the microstrip wiring board via a bump.

REFERENCES:
patent: 4250520 (1981-02-01), Denlinger
patent: 4617586 (1986-10-01), Cuvilliers et al.
patent: 4812792 (1989-03-01), Leibowitz
patent: 5087896 (1992-02-01), Wen et al.
patent: 5341115 (1994-08-01), Frei et al.
Bahl and Bhartia, Microwave Solid State Circuit Design, 1988, pp. 781-805 & p. 827.
Wang, Fundamentals of Semiconductor Theory and Device Physics, 1989, pp. 462-463.
Mitsui et al., "Technology Growth for 1980's," May 1980, pp. 6-8.

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