Multilayer microelectronic wiring module and method for forming

Details Multilayer microelectronic wiring module and method for forming Multilayer microelectronic wiring module and method for forming

1993-10-29

1996-05-21

Bryant, David P.

Metal working

Method of mechanical manufacture

Electrical device making

174264, H05K 336

Patent

active

055177514

ABSTRACT:
A multilayer microelectronics module formed by laminating together individual thermoplastic polymer sheets formed by injection, compression or other suitable molding techniques. Metal pieces to form vias of a desired shape and size are inserted into the molded sheets, preferably by in situ insert molding. The vias provide an electrical connection from the top to the bottom surfaces of the sheets.

REFERENCES:
patent: 4802061 (1989-01-01), Portugall et al.
patent: 4963428 (1990-10-01), Harvey et al.
patent: 5046238 (1991-09-01), Daigle et al.

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