Multilayer microelectronic circuit

Details Multilayer microelectronic circuit Multilayer microelectronic circuit

1998-02-26

2000-04-04

Sough, Hyung-Sub

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174260, 333175, 333185, 333219, H05K 111, H03H 302

Patent

active

060464097

ABSTRACT:
A multilayer microelectronic circuit to be directly mounted on a substrate and to be used, for example, as a resonator. The multilayer microelectronic circuit comprises a plurality of dielectric layers and patterned electrodes which are laminated one upon another to form a laminated structure, the dielectric layers and the patterned electrodes forming an electrical circuit. The laminated structure has side surfaces extending along a direction in which the dielectric layers and the patterned electrodes are laminated. An input line is formed at one of the side surfaces and connected with an input section of the electrical circuit. An output line is formed at one of the side surfaces and connected with an output section of the electrical circuit. A grounding line is formed at one of the side surfaces and connected with a grounding section of the electrical circuit. Additionally, a signal line formed at one of the side surfaces, for connecting sections of the electrical circuit. The signal line has an end positioned adjacent a mounting surface at which the multilayer microelectronic circuit is directly mounted on the substrate, in which the end of the signal line is separate from the mounting surface so as to be insulated from electrical contact with the substrate.

REFERENCES:
patent: 3349480 (1967-10-01), Rashleigh
patent: 4821007 (1989-04-01), Fields et al.
patent: 5160907 (1992-11-01), Nakajima et al.
patent: 5404118 (1995-04-01), Okamura et al.
patent: 5612656 (1997-03-01), Sakamoto et al.

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