Multilayer metalized composite on polymer film product and proce

Details Multilayer metalized composite on polymer film product and proce Multilayer metalized composite on polymer film product and proce

1998-03-26

2000-03-28

Turner, Archene

Stock material or miscellaneous articles

Structurally defined web or sheet

Continuous and nonuniform or irregular surface on layer or...

428156, 428164, 428209, 428212, 428421, 428469, 428472, 4284735, 428480, 428698, G32B 300

Patent

active

060429291

ABSTRACT:
A composite substrate material useful for fabricating printed circuits is provided comprising a polymeric film having at least one surface modified by plasma etching, a first thin metal nitride layer, a thin second metal nitride layer, and an electrically conductive third metal layer.

REFERENCES:
patent: 4226932 (1980-10-01), Ferraris
patent: 4337279 (1982-06-01), Polak
patent: 4382101 (1983-05-01), Polak
patent: 4450201 (1984-05-01), Brill et al.
patent: 4597828 (1986-07-01), Tadros
patent: 4725504 (1988-02-01), Knudsen et al.
patent: 4806395 (1989-02-01), Walsh
patent: 4868071 (1989-09-01), Walsh et al.
patent: 5137791 (1992-08-01), Swisher
patent: 5372848 (1994-12-01), Blackwell et al.
patent: 5413687 (1995-05-01), Barton et al.
patent: 5589280 (1996-12-01), Gibbons et al.
patent: 5874770 (1999-02-01), Saia et al.
Chang, C.; "enhancedCu-Teflon Adhesionoby Pre-Sputtering Prior to theCu Deposition". A. App; Phys. Lett. 51(16) 1236; Oct. 1987). B. Appl. Phys. Lett. 51(2), 13 103; (Jul. 1987).
Westwood, "Sputter Deposition Processes", MRS Bulletin; (Dec. 1988); pp. 46-51.
Ishii, M., et al; "Copper Sputtered Polyimide films and Their Applications", Proceedings of the Printed circuit World Convention VI, San Francisco, CA, May 11-14, 1993.
Weber, A., et al; "Metalization of Polymers Using Plasma-Enhanced Chemical Vapor Deposited Titanium Nitride as Interlayer", J. Electrochem. soc., vol. 144(No. 3), 1131-1135; (Mar. 1997).
Bergstresser, T. R., et al; "Peel Strength of Adhesiveless Polyimide Laminates After Thermal and Chemical Exposure"; Proceedings on Fourth Intl. Conf. on Flex Circuits (Flexcon 97), Sunnyvale, CA, Sep. 22-24 (1997).

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