Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent
1995-02-21
1996-06-11
Limanek, Robert P.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
257693, 257695, 257741, 257762, 257765, 257771, 257750, 257666, H01L 23495
Patent
active
055258360
ABSTRACT:
A leadframe for use in mounting and interconnecting an integrated circuit. A first or base metal layer of the leadframe comprises at least one of brass or other copper alloy. A second, conducting layer atop the base layer comprises at least one of aluminum or an aluminum alloy. A third, upper layer on the second layer comprises at least one of copper or a copper alloy. The first, second and third layers are formed into a multilayer clad strip, a portion of at least the third layer being selectively removed to expose a selected pattern of the second layer.
REFERENCES:
patent: 3559285 (1971-02-01), Kauffman
patent: 4480262 (1984-10-01), Butt
patent: 4599120 (1986-07-01), Churzh et al.
patent: 4761518 (1988-08-01), Butt et al.
patent: 5014113 (1991-05-01), Casto
patent: 5015803 (1993-05-01), Mahnlikar et al.
patent: 5329159 (1994-07-01), Lin
Limanek Robert P.
Technical Materials, Inc.
Williams Alexander Oscar
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