Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1993-06-28
1995-10-03
Picard, Leo P.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
361735, 257686, 257693, 257700, 257705, H01L 2302, H01L 2312, H01L 2314/23/32
Patent
active
054553857
ABSTRACT:
A packaging assembly for a semiconductor circuit chip is formed of a hermetically sealable, `tub`-like structure. The tub-like structure is comprised a laminated stack of thin layers of low temperature co-fired ceramic (LTCC) material. The laminated stack of LTCC layers contains an internally distributed network of interconnect links through which a semiconductor die, that has been mounted at a floor portion of the tub, may be electrically connected to a plurality of conductive recesses or pockets located at top and bottom sidewall edge portions of the tub, thereby allowing multiple tubs to be joined together as a hermetically sealed assembly and electrically interconnected at the conductive pockets of adjacent tubs.
REFERENCES:
patent: 3370203 (1968-02-01), Kravitz
patent: 3927815 (1975-12-01), Mase
patent: 4608592 (1986-08-01), Miyamoto
patent: 4630172 (1986-12-01), Stenerson
patent: 4635093 (1987-01-01), Ross
patent: 4646128 (1987-02-01), Carson et al.
patent: 4705917 (1987-11-01), Gates, Jr.
patent: 4764846 (1988-08-01), Go
patent: 4799984 (1989-01-01), Rellick
patent: 4806188 (1989-02-01), Rellick
patent: 4894706 (1990-01-01), Sato et al.
patent: 5043794 (1991-08-01), Tai
patent: 5058265 (1991-10-01), Goldfarb
patent: 5128831 (1992-07-01), Fox, III et al.
Myers Christopher A.
Newton Charles M.
Palmer Edward G.
Sanchez Albert
Harris Corporation
Picard Leo P.
Ryan Stephen T.
Wands Charles E.
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