Multilayer laminated circuit board

Details Multilayer laminated circuit board Multilayer laminated circuit board

2008-05-20

2008-05-20

Mai, Anh T (Department: 2832)

Inductor devices

Coil or coil turn supports or spacers

Printed circuit-type coil

C336S223000, C336S232000

Reexamination Certificate

active

07375609

ABSTRACT:
A multi-layer laminated circuit board10A of the present invention is formed by laminating together a multi-layer transformer10, a multi-layer part sheet30formed with a multi-layer part, and a wiring sheet50formed with a circuit pattern. The multi-layer transformer10is incorporated into the multi-layer laminated circuit board10A, and therefore a package for the multi-layer transformer10is omitted, and the wiring between the multi-layer transformer10and other components is reduced to a minimum.

REFERENCES:
patent: 6573821 (2003-06-01), Peels et al.
patent: 6917274 (2005-07-01), Hong et al.
patent: 6998951 (2006-02-01), Itou et al.

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